Micro Chip Holder 100μｍ×200μｍ
■ Patent Coulomb-Force E-Chuck (Same Adhesion in Every Area, Workable in Vacuum) : ●Ideal Holder for Thin, Warp, Fragile Wafer, Flat Glass, etc ■ Main Handling Applications ①Thin Wafers, Warp Wafers _4,6,8,12-inch ②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT) ③3D IC Fabric Package, 3D Print, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC ④Flat Glass ⑤Micro-LED ⑥Soft Copper Foil ⑦Soft Film ⑧Vacuum Lamination for OLED or Touch Panel ⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck) ■ Main Products : ①Micro Chip Holder 100μｍ×200μｍ youtu.be/QE_7KdXYbMU ②Thin Wafer Carrier_4,6,8,12-inch: MESC, Mobile ElectroStatic Carrier Supporter youtu.be/frCZIZ0A2x0 ③Thin Wafer SEMI-AUTO Bonding of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch youtu.be/wyCkQKMMBl8 ④Thin Wafer SEMI-AUTO Debonding of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch youtu.be/4P9fOD3fNuU ⑤Thin Wafer FULL-AUTO Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12 inch youtu.be/SpoY8CE7Re0 ⑥Thin Wafer Robot Holder youtu.be/w85Cb-R6c58 ⑦Thin Wafer Palm Holder youtu.be/nKiL2Q9khUY ⑧Thin Wafer Palm Holder: 100um Thin Wafer Handling youtu.be/9pc62aUH-i8 ⑨Thin Foil Holder youtu.be/vlwnmlcFDZ4 ⑩Thin Wafer/Glass/Foil/Paper Handling by Patent E-Chuck youtu.be/YE7g5NxWf3k ⑪ Thin Wafer/Glass/Foil Handling Solutions of Patent E-Chuck youtu.be/Tc31Xa19HVM ■ Other Products ⑫(Cordless) Battery Power Holder ⑬2D Curved Holder ⑭3D Curved Holder ⑮AOI Black Holder ⑯Huge Stitching Holder ⑰Other Custom E-Chucks ■ Patent Coulomb-Force E-Chuck Advanced technology encloses the electrical field in the E-Chuck. E-Chuck becomes a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel. Patent Coulomb-Force E-Chuck has the best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is an ideal handling tool for soft and thin materials. ■ Operational Environment (1) Atmospheric Pressure. (2) Vacuum Environment. ■ Adsorbable Material (1) Metal conductor (e.g., copper foil) (2) Semiconductors (e.g., silicon, GaAs) (3) Insulators (e.g., paper, glass panel) (4) Porous objects. (5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness. (6) The material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd. ■ Features of Patent Coulomb-Force E-Chuck (1) Coulomb-Force Electrostatic Chuck. (2) Patent Coulomb-Force E-Chuck was developed a long time and has dozens of international patents. (3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode (4) Apply the lowest voltage to keep maximum adhesion force. (5) Because the voltage potential of the object backside is zero, adhesion will not affect the backside circuits. (6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials. (7) Work normally in vacuum environments and general atmospheric environments. (8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions. (9) It can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass. (10) It can be customized into various sizes and thicknesses for customer's applications. (11) Advanced technology encloses the electrical field in the E-Chuck. E-Chuck becomes a move-free carrier. (12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel. Patent Coulomb-Force E-Chuck has been developed for a long time and has dozens of international patents. ■ Contact info : E-mail : sales@edragontek.com EDRAGON TECHNOLOGY CORPORATION
