■ Main Handling Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)