Patent Advanced E-Chuck, Electrostatic Chuck
Patent Advanced E-Chuck, Electrostatic-Chuck (having dozens of international patents, can adhere various kind of Metal / Semiconductor / Glass / Paper / Porous materials.) Main Applications : Wonderful CARRIER and Handling Tools for VACUUM, FLEXIBLE and THINNING Film/Wafer/Glass Machining Ex: thin film, 6 "-on-8" vehicles, curved screen, no border screens, OLED vacuum lamination. 1. Vacuum Environment : Vacuum Plating, Vacuum No-Air-Gap Bonding 2. Porous Adhesion : Porous or Irregular Shape Adhesion Ability 3. Carrier Supporter : Thin Film/Glass/Wafer Handling, Warpage Correction, Shape Carrier Special Product Characteristics : 1. can adhere various kind of materials, such as Metal / Semiconductor Wafer / Glass Panel / Thin Film / Paper. 2. can work well in Atmosphere and Vacuum environment 3. can keep adhesion without keeping power connection 4. can be customized to various shape Product classifications: 1. Stage Holder 2. Cordless Supporter 3. Soft Palm 4. Customized products Product notice: 1. Operation Temperature larger than 75 C degree, then need heat-resistant treatment 2. Max. operation Temperature : 200 C degree on chuck surface. Patent Advanced E-Chuck (Electrostatic Chuck) Demo Video : Patent Advanced E-Chuck Ability：specially adhere various kind of metal / semiconductor wafer / glass panel / thin film / paper youtu.be/YE7g5NxWf3k Patent Advanced E-Chuck Palm for Semiconductor Wafer Adhesion youtu.be/nKiL2Q9khUY Patent Advanced E-Chuck Supporter (without keeping power connection) for Warpage Support & Handling youtu.be/frCZIZ0A2x0 Patent Advanced E-Chuck for Glass & Paper Adhesion youtu.be/w85Cb-R6c58 Patent Advanced E-Chuck for Copper Foil Adhesion youtu.be/vlwnmlcFDZ4 Welcome to contact us to get more info !! Wish become one of your long term partners. Contact info : Mobile: +886-915-669-072 (LINE, WeChat, Whatsapp) email : sales@edragontek.com EDRAGON TECHNOLOGY CORPORATION
